In response to consumer demand for even slimmer, more light-weight mobile appliances, the corresponding level of integration needed to meet this requirement led to the development of BGA (Ball Grid Array) and CSP (Chip Size Package) technology, thus replacing previously used QFP (Quad Flat Pack) components. Now in widespread use throughout the electronics industry, BGA and CSP components are connected to the circuit board by means of minute solder balls. However, stresses such as heat cycling, board warping and thermal shock, can sometimes interrupt the connection between the BGA and/or the CSP and the circuit board. To prevent this, Fuji Chemical have developed Seal-glo UF300 Series, an underfill agent which readily penetrates the gaps between the BGA and/or CSP and the circuit board, in turn, contributing to improved bonding reliability. As Seal-glo UF300 Series hardens, it reduces stress and also reinforces the solder bonding. Easily repairable, Seal-glo UF300 Series permits the re-use of expensive electronic parts and circuit boards, thus offering substantial savings.