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For modern PCB-level electronic assembly using surface mount technology, solder paste is widely used as the joining material. We have made a lot of efforts to develop our solder paste with our own brand .With the aim to satisfy the market requirement and follow the developing tendency of environmental protection, systematical research works are being carried out. We will do our best to provide series of solder paste products marked with our own brand and excellent technical support to promote the cooperation between us.
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Basic concept and characteristic of Solder Paste
Solder paste is a cream-like mixture of solder alloy powder and flux/vehicle system;
Solder paste should be rheological, i.e., its viscosity will decrease under the action of shear stress to favor the printing process but recover afterward to help to fix the electronic components before reflow;
During the reflow process, the flux system will remove the surface oxidation layer and then the molten solder alloy will wet and react with the component terminal and metal pad on PCB and finally form the mechanical and electrical joining.
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Sorts of Solder Paste
By solder alloy composition, Pb-contained or Pb-free solder paste;
By cleaning method, Rosin based, water soluble or no-clean solder paste;
By flux type, Rosin, Rosin Medium Activated, Rosin Activated or Organic based solder paste;
By applying method, solder paste for stencil printing, screen printing or syringe dispensing.
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