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Cemedine EP001K,EP138

  • Cemedine EP001K,EP138
  • Cemedine EP001K,EP138
Model No.︰EP001K,EP138
Brand Name︰Cemedine
Country of Origin︰Japan
Unit Price︰CNY ¥ 85 / pc
Minimum Order︰10 pc
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Product Description

Epoxy Resin AdhesiveEpoxy/silyl terminated polyether elastic adhesive

Features

  • This two-part reactive mixture—an epoxy/silyl terminated polyether elastic adhesive—offers a flexible and resilient property that, in clear contrast to the hard and brittle characteristic of conventional epoxy resin adhesives, achieves a major transformation into an adhesive that will not peel off.
  • For bonding that requires a high peel resistance and a high shear adhesive strength.
  • For bonding in vibrating locations.
  • For bonding in an environment subject to large stress variations.
  • For bonding different types of materials with substantially different linear expansion coefficients.
  • For bonding various types of engineering plastics.

    Application

  • Applications that require elastic adhesion
    1. Bonding of different types of materials with substantially different linear expansion coefficients.
    2. Bonding in vibrating locations and in environments subject to large stress variations.
    3. Bonding in locations with a large internal strain caused by environmental changes such as thermal cycles.
  • Applications that require a high peel resistance and a high shear adhesive strength
  • Bonding of engineering plastics including commodity plastics
    1. Casting and bonding of electrical and electronic parts.
    2. Bonding of glass used in precision equipment and optical equipment.
    3. Bonding of building components.
    4. Bonding of craft products.
  • Product data

    Adhesive properties for various types of adherends

    (MPa)

      Tensile shear strength Failure Modes
    Plastic PVC 5.51 CF
    PC 5.46 CF
    ABS 5.38 CF
    PMMA 3.72 CF2AF8
    6Ny 4.07 CF8AF2
    PET 4.88 MF
    PBT 3.44 AF
    PPO 4.16 CF5AF5
    PPS 4.19 CF5AF5
    Metal SPCC 6.15 CF
    AL 7.57 CF7AF3
    SUS 5.90 CF8AF2

    *CF:Cohesion Failure, AF:Adhesive Failure, TCF:Thin layer cohesion failure, MF:Failure Modes
    The numbers indicate their proportion to the adhesion area.

    Test method : JIS K6850
    Curing: 23°C50%RH×7 days

    Characteristics by mixing ratio

    Mixing ratio
    (Base resin : Hardener)
    Tensile shear strength Peeling strength Hardness
    (Shore A)
    Adhesion strength Failure Modes Adhesion strength Failure Modes
    60 : 40 6.04 MPa CF 2.90 N/mm CF 75
    55 : 45 6.15 MPa CF 3.14 N/mm CF 72
    50 : 50 6.15 MPa CF 3.85 N/mm CF 72
    45 : 55 7.10 MPa CF 4.12 N/mm CF 71
    40 : 60 6.09 MPa CF 3.90 N/mm CF 69

    *CF:Cohesion Failure
    Test method: JIS K6850

    Adherends: Steel plate
    Surface treatment: Degreased with MEK
    Curing: 23°C50%RH×7 days

    Heat aging test

    s_t_EP001K_netsurouka.jpg

    (MPa)

    Test conditions
    (temperature×time)
    Tensile shear strength
    Initial value 6.15 CF
    100°C 500h 7.56 CF
    1000h 7.53 CF
    120°C 100h 6.11 CF
    250h 5.38 CF
    500h 4.61 CF
    1000h 2.59 CF
    150°C 100h 6.15 CF
    250h 3.10 CF
    500h 3.08 CF
    1000h 2.68 CF
    180°C 100h 2.10 CF
    250h 1.20 AF

    *CF:Cohesion Failure,AF:Adhesive Failure
    Test method : JIS K6850

    Adherends: Steel plate
    Surface treatment: Degreased with MEK
    Tension speed: 50 mm/min

    Tensile shear strength on each temp

    s_t_EP001K_nekkan.jpg

    (MPa)

      Adhesion strength Failure Modes
    -40°C 8.96 CF
    23°C 6.15 CF
    50°C 5.95 CF
    80°C 6.27 CF
    100°C 6.13 CF
    120°C 2.83 CF3AF7
    150°C 2.64 CF2AF8

    *CF:Cohesion Failure

    Test method : JIS K6850
    Adherends: Steel plate
    Surface treatment: Degreased with MEK
    Tension speed: 50 mm/min

    High-temperature and high-humidity test

    s_t_EP001K_koonkoshituyosikawa.jpg

    (MPa)

      Adhesion strength Failure Modes
    Initial value 7.57 CF
    85°C85% 100h 8.96 CF
    250h 7.83 CF
    500h 7.14 CF
    1000h 6.81 CF

    *CF:Cohesion Failure

    Test method : JIS K6850
    Adherends: Aluminum

    Property

      EP001K
    Base resin Hardener
    Application / Properties / Features Elasticity
    Type Two-part epoxy adhesive curing at room temperature
    Base Epoxy resin Silyl terminated polyether
    Appearance Milky white Light yellow
    Non-volatiles wt% 99 97
    Viscosity Pa・s/23°C 14 18
    Density g/cm3 1.15 1.00
    Standard curing conditions 23°C×7days
    23°C 3days+50°C 3days
    Mixing ratio 1 : 1
    Pot life 23°C 11 min.
    Set time 23°C 40 min.
    Time required for effective curing 23°C 24 hours
    Cured properties Hardness Shore A 72
    Glass transition temperature °C -65
    Elastic modulus MPa 3.2
    Breaking strength MPa 6.7
    Elongation at break % 200
    Water absorption ratio % 1.8
    Linear expansion coefficient   15×10-5
    Capacity 320ml set
    2kg set
Price Terms︰FOB HONGKONG, FOB SHENZHEN
Payment Terms︰TT
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