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Fuji SMT Sealing Tape
Fuji SMT Sealing Tape  US $ 1
SMT Sealing Tape When detaching carrier tapes with remaining electrical components, there is a chance that those components may drop out if the top tape on its end peels off prematurely. SMT sealing tape is used for temporary fixing to prevent component drop out.   This tape is for a demon...
Fuji Seal-glo 602MCF Insulating moistureproof coating Comformal
Fuji Seal-glo 602MCF Insulating moistureproof coating Comformal  US $ 60
Insulating moistureproof coating Comformal coating series The mounting density of PCBs can be called the heart of electronic appliances and equipment. This mounting density has increasingly become higher to result in the narrowing of space between leads. Furthermore, usage requires PCBs produ...
Fuji Seal-glo AD80C AD60CH
Fuji Seal-glo AD80C AD60CH  US $ 60
“Seal-glo NE series” are a range of adhesives developed for temporary chip-bonding, prior to the wave-soldering process. They are all single component, heat-curing, epoxy adhesives which have excellent preservation qualities.“Seal-glo NE series” not only have rapid curing properties, with a 1~2 min...
Fuji UF317H UF330H
Fuji UF317H UF330H  US $ 60
In response to consumer demand for even slimmer, more light-weight mobile appliances, the corresponding level of integration needed to meet this requirement led to the development of BGA (Ball Grid Array) and CSP (Chip Size Package) technology, thus replacing previously used QFP (Quad Flat Pack) co...
Fuji Seal-glo NE7200H NE7300H
Fuji Seal-glo NE7200H NE7300H  US $ 60
“Seal-glo NE series” are a range of adhesives developed for temporary chip-bonding, prior to the wave-soldering process. They are all single component, heat-curing, epoxy adhesives which have excellent preservation qualities.“Seal-glo NE series” not only have rapid curing properties, with a 1~2 min...
Fuji Seal-glo NE8800K NE8800T
Fuji Seal-glo NE8800K NE8800T  US $ 60
“Seal-glo NE series” are a range of adhesives developed for temporary chip-bonding, prior to the wave-soldering process. They are all single component, heat-curing, epoxy adhesives which have excellent preservation qualities.“Seal-glo NE series” not only have rapid curing properties, with a 1~2 min...
Fuji Seal-glo NE3000S NE3300H
Fuji Seal-glo NE3000S NE3300H  US $ 60
“Seal-glo NE series” are a range of adhesives developed for temporary chip-bonding, prior to the wave-soldering process. They are all single component, heat-curing, epoxy adhesives which have excellent preservation qualities.“Seal-glo NE series” not only have rapid curing properties, with a 1~2 min...

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